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   Name:Reflow Soldering Conditions
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REFLOW SOLDERING CONDITIONS  

 

 

1.       A thermal condition system such as infrared radiation (IR) or hot blast shall be adopted, and vapor heat transfer systems (VPS) are not recommended.

2.       Reflow shall be done within 2 cycles. Please make sure that the parts have enough cooling time.

3.         The time of preheating from 150 to 200 shall be within 180 seconds maximum;

The time of soldering temperature at 217 measured on capacitors’ top shall not exceed tL (second);

                The peak temperature on capacitors’ top shall not exceed Tp(), and the time within 5 of actual peak temperature shall not exceed tp (second).  

 

 

     Classification Reflow Profile                    

         

                    *1. Average ramp-up rate is 3/second max. 

                    *2. Ramp-down rate is 6/second max.           

                    *3 Time from 25 to peak temperature is 8 minutes max.  

 

 

     Classified at Temperature and Time for All Products  

       

Size

Thickness ()

Volume (3)

Tp ()

t L(second)

tp(second)

Φ4~Φ6.3 & Φ8×6.2L

2.5

< 350

250±0

90

40

Φ8×10.5L

2.5

3502000

240±0

90

30

Φ10×10.5L / 13.5L

2.5

3502000

235±0

60

30

Φ12.5 & Φ16

2.5

> 2000

230±0

30 (20)

20

Refer to Table 4-2, 5-2 and Figure 5-1, IPC/JEDEC J-STD-020C                        

          Re: (20) is special for mid-to-high voltage V-chip capacitors which is HU series made by KJ.

                    

 

     Classified at Temperature and Time Only for Standard Size without  (  )  

       

Size

Thickness ()

Volume (3)

Tp ()

t L(second)

tp(second)

Φ4~Φ6.3 & Φ8×6.2L

2.5

< 350

260±0

90

5

Φ8×10.5L

2.5

3502000

260±0

90

5

Φ10×10.5L / 13.5L

2.5

3502000

260±0

60

5

 
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